The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA)

Hwan Pil Park, Seongchul Kim, Taeyoung Lee, Sehoon Yoo, Young-Ho Kim, Jae Yong Park Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The effects of nonconductive adhesive (NCA) trapping on the reliability of low-temperature (150°C) thermo-compression (TC)-bonded flip-chip joints were investigated in this study. Both rough and smooth Cu pads were employed to investigate the effects of surface roughness on NCA trapping, with Sn-Ag solder-capped Cu pillar bumps bonded onto the Cu pads via low-temperature TC bonding. The NCA trapping in the rough Cu pad sample was much greater than that in the smooth Cu pad sample after TC bonding. In addition, the NCA trapping increased with decreasing bonding pressure. The electrical resistance for both the rough and smooth Cu pad samples increased after preconditioning (moisture sensitive level 3) and thermal cycling (-55°C/125°C) reliability tests. The high electrical resistance of the rough Cu pad sample was due to the crack propagation caused by the expansion of the trapped NCA. The reliability of the flip chip joint increased with increasing bonding pressure increased and decreasing surface roughness.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1937-1941
Number of pages5
ISBN (Print)9781538649985
DOIs
StatePublished - 2018 Aug 7
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: 2018 May 292018 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2018-May
ISSN (Print)0569-5503

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
CountryUnited States
CitySan Diego
Period18/05/2918/06/1

Fingerprint

Soldering alloys
Adhesives
Compaction
Acoustic impedance
Temperature
Surface roughness
Thermal cycling
Crack propagation
Moisture

Keywords

  • Flip-chip joints
  • Nonconductive adhesive
  • Reliability testing
  • Thermo-compression bonding

Cite this

Park, H. P., Kim, S., Lee, T., Yoo, S., Kim, Y-H., & Park, J. Y. P. (2018). The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA). In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (pp. 1937-1941). [8429803] (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2018.00290
Park, Hwan Pil ; Kim, Seongchul ; Lee, Taeyoung ; Yoo, Sehoon ; Kim, Young-Ho ; Park, Jae Yong Park. / The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA). Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1937-1941 (Proceedings - Electronic Components and Technology Conference).
@inproceedings{62e4b2098530497d932fee11ef767dbb,
title = "The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA)",
abstract = "The effects of nonconductive adhesive (NCA) trapping on the reliability of low-temperature (150°C) thermo-compression (TC)-bonded flip-chip joints were investigated in this study. Both rough and smooth Cu pads were employed to investigate the effects of surface roughness on NCA trapping, with Sn-Ag solder-capped Cu pillar bumps bonded onto the Cu pads via low-temperature TC bonding. The NCA trapping in the rough Cu pad sample was much greater than that in the smooth Cu pad sample after TC bonding. In addition, the NCA trapping increased with decreasing bonding pressure. The electrical resistance for both the rough and smooth Cu pad samples increased after preconditioning (moisture sensitive level 3) and thermal cycling (-55°C/125°C) reliability tests. The high electrical resistance of the rough Cu pad sample was due to the crack propagation caused by the expansion of the trapped NCA. The reliability of the flip chip joint increased with increasing bonding pressure increased and decreasing surface roughness.",
keywords = "Flip-chip joints, Nonconductive adhesive, Reliability testing, Thermo-compression bonding",
author = "Park, {Hwan Pil} and Seongchul Kim and Taeyoung Lee and Sehoon Yoo and Young-Ho Kim and Park, {Jae Yong Park}",
year = "2018",
month = "8",
day = "7",
doi = "10.1109/ECTC.2018.00290",
language = "English",
isbn = "9781538649985",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1937--1941",
booktitle = "Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018",

}

Park, HP, Kim, S, Lee, T, Yoo, S, Kim, Y-H & Park, JYP 2018, The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA). in Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018., 8429803, Proceedings - Electronic Components and Technology Conference, vol. 2018-May, Institute of Electrical and Electronics Engineers Inc., pp. 1937-1941, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, San Diego, United States, 18/05/29. https://doi.org/10.1109/ECTC.2018.00290

The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA). / Park, Hwan Pil; Kim, Seongchul; Lee, Taeyoung; Yoo, Sehoon; Kim, Young-Ho; Park, Jae Yong Park.

Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1937-1941 8429803 (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA)

AU - Park, Hwan Pil

AU - Kim, Seongchul

AU - Lee, Taeyoung

AU - Yoo, Sehoon

AU - Kim, Young-Ho

AU - Park, Jae Yong Park

PY - 2018/8/7

Y1 - 2018/8/7

N2 - The effects of nonconductive adhesive (NCA) trapping on the reliability of low-temperature (150°C) thermo-compression (TC)-bonded flip-chip joints were investigated in this study. Both rough and smooth Cu pads were employed to investigate the effects of surface roughness on NCA trapping, with Sn-Ag solder-capped Cu pillar bumps bonded onto the Cu pads via low-temperature TC bonding. The NCA trapping in the rough Cu pad sample was much greater than that in the smooth Cu pad sample after TC bonding. In addition, the NCA trapping increased with decreasing bonding pressure. The electrical resistance for both the rough and smooth Cu pad samples increased after preconditioning (moisture sensitive level 3) and thermal cycling (-55°C/125°C) reliability tests. The high electrical resistance of the rough Cu pad sample was due to the crack propagation caused by the expansion of the trapped NCA. The reliability of the flip chip joint increased with increasing bonding pressure increased and decreasing surface roughness.

AB - The effects of nonconductive adhesive (NCA) trapping on the reliability of low-temperature (150°C) thermo-compression (TC)-bonded flip-chip joints were investigated in this study. Both rough and smooth Cu pads were employed to investigate the effects of surface roughness on NCA trapping, with Sn-Ag solder-capped Cu pillar bumps bonded onto the Cu pads via low-temperature TC bonding. The NCA trapping in the rough Cu pad sample was much greater than that in the smooth Cu pad sample after TC bonding. In addition, the NCA trapping increased with decreasing bonding pressure. The electrical resistance for both the rough and smooth Cu pad samples increased after preconditioning (moisture sensitive level 3) and thermal cycling (-55°C/125°C) reliability tests. The high electrical resistance of the rough Cu pad sample was due to the crack propagation caused by the expansion of the trapped NCA. The reliability of the flip chip joint increased with increasing bonding pressure increased and decreasing surface roughness.

KW - Flip-chip joints

KW - Nonconductive adhesive

KW - Reliability testing

KW - Thermo-compression bonding

UR - http://www.scopus.com/inward/record.url?scp=85051992546&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2018.00290

DO - 10.1109/ECTC.2018.00290

M3 - Conference contribution

AN - SCOPUS:85051992546

SN - 9781538649985

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1937

EP - 1941

BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Park HP, Kim S, Lee T, Yoo S, Kim Y-H, Park JYP. The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA). In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1937-1941. 8429803. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2018.00290