Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

Hwan Pil Park, Gwancheol Seo, Sungcheol Kim, Key one Ahn, Young-Ho Kim

Research output: Contribution to journalArticle

Abstract

Shear strength between Sn–3.0Ag–0.5Cu (SAC) solders and Cu/Ti in under bump metallization (UBM) samples aged using two solid-state aging processes was investigated. One method aged the samples at 200 °C for up for five 1-h intervals; the other aged the samples at 200 °C continuously for up to 5 h in a convection oven. After reflow, all samples showed scallop-shaped Cu6Sn5 intermetallic compounds (IMCs) at the interfaces between SAC solder and Cu substrate. After aging, the Cu layers of all samples were gradually depleted, and lump-shaped Cu6Sn5 was observed to be separated from the SAC/Cu interfaces. The shear strength of all samples was gradually decreased with increased aging due to depletion of the Cu wetting layer, formation of IMCs with solder, and separation of the IMCs from the interfaces during aging. Quantitative analysis revealed that exposed Ti area is an effective predictor of decrease in shear strength generated by the spalling phenomenon.

Original languageEnglish
Pages (from-to)10550-10559
Number of pages10
JournalJournal of Materials Science: Materials in Electronics
Volume30
Issue number11
DOIs
StatePublished - 2019 Jun 15

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shear strength
solders
fans
Shear strength
Soldering alloys
Fans
Aging of materials
Intermetallics
solid state
Substrates
intermetallics
Spalling
Ovens
Metallizing
Wetting
spalling
ovens
quantitative analysis
wetting
depletion

Cite this

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title = "Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications",
abstract = "Shear strength between Sn–3.0Ag–0.5Cu (SAC) solders and Cu/Ti in under bump metallization (UBM) samples aged using two solid-state aging processes was investigated. One method aged the samples at 200 °C for up for five 1-h intervals; the other aged the samples at 200 °C continuously for up to 5 h in a convection oven. After reflow, all samples showed scallop-shaped Cu6Sn5 intermetallic compounds (IMCs) at the interfaces between SAC solder and Cu substrate. After aging, the Cu layers of all samples were gradually depleted, and lump-shaped Cu6Sn5 was observed to be separated from the SAC/Cu interfaces. The shear strength of all samples was gradually decreased with increased aging due to depletion of the Cu wetting layer, formation of IMCs with solder, and separation of the IMCs from the interfaces during aging. Quantitative analysis revealed that exposed Ti area is an effective predictor of decrease in shear strength generated by the spalling phenomenon.",
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Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications. / Park, Hwan Pil; Seo, Gwancheol; Kim, Sungcheol; Ahn, Key one; Kim, Young-Ho.

In: Journal of Materials Science: Materials in Electronics, Vol. 30, No. 11, 15.06.2019, p. 10550-10559.

Research output: Contribution to journalArticle

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AU - Park, Hwan Pil

AU - Seo, Gwancheol

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AU - Ahn, Key one

AU - Kim, Young-Ho

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AB - Shear strength between Sn–3.0Ag–0.5Cu (SAC) solders and Cu/Ti in under bump metallization (UBM) samples aged using two solid-state aging processes was investigated. One method aged the samples at 200 °C for up for five 1-h intervals; the other aged the samples at 200 °C continuously for up to 5 h in a convection oven. After reflow, all samples showed scallop-shaped Cu6Sn5 intermetallic compounds (IMCs) at the interfaces between SAC solder and Cu substrate. After aging, the Cu layers of all samples were gradually depleted, and lump-shaped Cu6Sn5 was observed to be separated from the SAC/Cu interfaces. The shear strength of all samples was gradually decreased with increased aging due to depletion of the Cu wetting layer, formation of IMCs with solder, and separation of the IMCs from the interfaces during aging. Quantitative analysis revealed that exposed Ti area is an effective predictor of decrease in shear strength generated by the spalling phenomenon.

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