Ultrasonics is used as an important nondestructive test tool in semiconductor reliability evaluation and failure analysis. Inspection of the die bottom to die attach adhesive interface for thin die has proven difficult as the reflected signals from the die top and bottom are superimposed. It is important that inspection of delamination of the bottom of the die can take place as it can greatly affect the thermal conductivity of thin semiconductor devices. In this study a transfer function technique is used to separate the reflected signal from the die bottom from the superimposed signal.
|Number of pages||5|
|Journal||Annual Proceedings - Reliability Physics (Symposium)|
|State||Published - 1997 Jan 1|
|Event||Proceedings of the 1997 35th Annual IEEE International Reliability Physics Symposium - Denver, CO, USA|
Duration: 1997 Apr 8 → 1997 Apr 10