Separation of superimposed ultrasonics pulse echo signals for semiconductor failure analysis using scanning acoustic tomography (S.A.T.)

Hyoseong Jang, Kyungyoung Jhang, Dongkyung Lee

Research output: Contribution to journalConference article

4 Scopus citations

Abstract

Ultrasonics is used as an important nondestructive test tool in semiconductor reliability evaluation and failure analysis. Inspection of the die bottom to die attach adhesive interface for thin die has proven difficult as the reflected signals from the die top and bottom are superimposed. It is important that inspection of delamination of the bottom of the die can take place as it can greatly affect the thermal conductivity of thin semiconductor devices. In this study a transfer function technique is used to separate the reflected signal from the die bottom from the superimposed signal.

Original languageEnglish
Pages (from-to)136-140
Number of pages5
JournalAnnual Proceedings - Reliability Physics (Symposium)
StatePublished - 1997 Jan 1
EventProceedings of the 1997 35th Annual IEEE International Reliability Physics Symposium - Denver, CO, USA
Duration: 1997 Apr 81997 Apr 10

Fingerprint Dive into the research topics of 'Separation of superimposed ultrasonics pulse echo signals for semiconductor failure analysis using scanning acoustic tomography (S.A.T.)'. Together they form a unique fingerprint.

  • Cite this