Semi-analytical design sensitivity analysis of a coupled problem with a commercial finite element package

Tae Hee Lee, M. U. Lee, J. H. Yoo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper proposes an effective computational technique for design sensitivity analysis (DSA), the so-called displacement load method for semi-analytical design sensitivity analysis of coupled systems such as thermal-structure coupled system and electromagnetic-structure coupled system. Displacement load method evaluates the pseudo-load for DSA by using the difference of nodal forces that are related with design variables in a coupled system. This method is suitable for implementation of DSA outside a commercial finite element package. Several numerical examples are performed to verify the proposed method.

Original languageEnglish
Title of host publicationProceedings of the 5th International Conference on Engineering Computational Technology
StatePublished - 2006 Dec 1
Event5th International Conference on Engineering Computational Technology, ECT 2006 - Las Palmas de Gran Canaria, Spain
Duration: 2006 Sep 122006 Sep 15

Publication series

NameProceedings of the 5th International Conference on Engineering Computational Technology

Other

Other5th International Conference on Engineering Computational Technology, ECT 2006
CountrySpain
CityLas Palmas de Gran Canaria
Period06/09/1206/09/15

Keywords

  • Coupled problem
  • Design sensitivity analysis
  • Displacement load method
  • Electromagnetic-structure problem
  • Semi-analytical method
  • Thermal-structure problem

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  • Cite this

    Lee, T. H., Lee, M. U., & Yoo, J. H. (2006). Semi-analytical design sensitivity analysis of a coupled problem with a commercial finite element package. In Proceedings of the 5th International Conference on Engineering Computational Technology (Proceedings of the 5th International Conference on Engineering Computational Technology).