Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

Sang Won Yoon, Michael D. Glover, H. Alan Mantooth, Koji Shiozaki

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

This paper presents the feasibility of highly reliable and repeatable copper-tin transient liquid phase (Cu-Sn TLP) bonding as applied to die attachment in high temperature operational power modules. Electrified vehicles are attracting particular interest as eco-friendly vehicles, but their power modules are challenged because of increasing power densities which lead to high temperatures. Such high temperature operation addresses the importance of advanced bonding technology that is highly reliable (for high temperature operation) and repeatable (for fabrication of advanced structures). Cu-Sn TLP bonding is employed herein because of its high remelting temperature and desirable thermal and electrical conductivities. The bonding starts with a stack of Cu-Sn-Cu metal layers that eventually transforms to Cu-Sn alloys. As the alloys have melting temperatures (Cu3Sn: > 600 °C, Cu 6Sn5: > 400 °C) significantly higher than the process temperature, the process can be repeated without damaging previously bonded layers. A Cu-Sn TLP bonding process was developed using thin Sn metal sheets inserted between copper layers on silicon die and direct bonded copper substrates, emulating the process used to construct automotive power modules. Bond quality is characterized using (1) proof-of-concept fabrication, (2) material identification using scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis, and (3) optical analysis using optical microscopy and scanning acoustic microscope. The feasibility of multiple-sided Cu-Sn TLP bonding is demonstrated by the absence of bondline damage in multiple test samples fabricated with double- or four-sided bonding using the TLP bonding process.

Original languageEnglish
Article number015017
JournalJournal of Micromechanics and Microengineering
Volume23
Issue number1
DOIs
StatePublished - 2013 Jan 1

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High temperature operations
Copper
Temperature
Acoustic microscopes
Fabrication
Remelting
Tin
Silicon
Sheet metal
Optical microscopy
Melting point
Thermal conductivity
Metals
Spectroscopy
Scanning
X rays
Scanning electron microscopy
Liquids
Substrates
Electric Conductivity

Cite this

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abstract = "This paper presents the feasibility of highly reliable and repeatable copper-tin transient liquid phase (Cu-Sn TLP) bonding as applied to die attachment in high temperature operational power modules. Electrified vehicles are attracting particular interest as eco-friendly vehicles, but their power modules are challenged because of increasing power densities which lead to high temperatures. Such high temperature operation addresses the importance of advanced bonding technology that is highly reliable (for high temperature operation) and repeatable (for fabrication of advanced structures). Cu-Sn TLP bonding is employed herein because of its high remelting temperature and desirable thermal and electrical conductivities. The bonding starts with a stack of Cu-Sn-Cu metal layers that eventually transforms to Cu-Sn alloys. As the alloys have melting temperatures (Cu3Sn: > 600 °C, Cu 6Sn5: > 400 °C) significantly higher than the process temperature, the process can be repeated without damaging previously bonded layers. A Cu-Sn TLP bonding process was developed using thin Sn metal sheets inserted between copper layers on silicon die and direct bonded copper substrates, emulating the process used to construct automotive power modules. Bond quality is characterized using (1) proof-of-concept fabrication, (2) material identification using scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis, and (3) optical analysis using optical microscopy and scanning acoustic microscope. The feasibility of multiple-sided Cu-Sn TLP bonding is demonstrated by the absence of bondline damage in multiple test samples fabricated with double- or four-sided bonding using the TLP bonding process.",
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Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles. / Yoon, Sang Won; Glover, Michael D.; Mantooth, H. Alan; Shiozaki, Koji.

In: Journal of Micromechanics and Microengineering, Vol. 23, No. 1, 015017, 01.01.2013.

Research output: Contribution to journalArticle

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