Preparation and characterization of slurry for chemical mechanical planarization (CMP)

J. Seo, Ungyu Paik

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)

Abstract

The physicochemical properties of slurry, such as particle size and distribution, surface chemistry, dispersion stability, and rheological behavior, are determined by the complex interaction between its components, which has significant influence on the chemical mechanical planarization (CMP) performances such as material removal rate, high planarity, uniformity, and defect. Thus, understanding the physicochemical properties of slurry is important to develop CMP slurries. In this chapter, we give a brief overview of the preparation and characterization of CMP slurry, and then mainly discuss the effect of slurry characterization on CMP performances.

Original languageEnglish
Title of host publicationAdvances in Chemical Mechanical Planarization (CMP)
PublisherElsevier Inc.
Pages1-298
Number of pages298
ISBN (Electronic)9780081002186
ISBN (Print)9780081001653
DOIs
StatePublished - 2016 Jan 8

Fingerprint

Chemical mechanical polishing
Slurries
Surface chemistry
Particle size
Defects

Keywords

  • CMP slurry
  • Colloidal chemistry
  • Slurry characterization
  • Slurry components

Cite this

Seo, J., & Paik, U. (2016). Preparation and characterization of slurry for chemical mechanical planarization (CMP). In Advances in Chemical Mechanical Planarization (CMP) (pp. 1-298). Elsevier Inc.. https://doi.org/10.1016/B978-0-08-100165-3.00011-5
Seo, J. ; Paik, Ungyu. / Preparation and characterization of slurry for chemical mechanical planarization (CMP). Advances in Chemical Mechanical Planarization (CMP). Elsevier Inc., 2016. pp. 1-298
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Preparation and characterization of slurry for chemical mechanical planarization (CMP). / Seo, J.; Paik, Ungyu.

Advances in Chemical Mechanical Planarization (CMP). Elsevier Inc., 2016. p. 1-298.

Research output: Chapter in Book/Report/Conference proceedingChapter

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