Non-conductive adhesive (NCA) trapping study in chip on glass joints fabricated using Sn bumps and NCA

Sang Mok Lee, Byeung Gee Kim, Young Ho Kim

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

Chip-on-glass (COG) bonding using a nonconductive adhesive (NCA) and the entrapment of NCA and fillers in the COG joints were studied. Sn was used as a bump material because it has a higher propensity of plastic deformation than an Au bump. Three types of Sn bumps were fabricated, electroplated Sn bumps, reflowed Sn bumps, and coined Sn bumps. Three types of NCAs were applied during COG bonding. The reflowed bump had the least amount of trapped NCA with fillers among the bumps studied. The NCA with the lowest viscosity was trapped the least compared to the other NCAs. The electrical test results showed that contact resistance increased with increasing amounts of trapped NCA with fillers in the COG joint.

Original languageEnglish
Pages (from-to)2100-2106
Number of pages7
JournalMaterials Transactions
Volume49
Issue number9
DOIs
StatePublished - 2008 Sep 1

Fingerprint

adhesives
Adhesives
trapping
chips
Glass
Glass bonding
fillers
glass
Fillers
entrapment
Contact resistance
contact resistance
plastic deformation
Plastic deformation
Viscosity
viscosity

Keywords

  • Chip on glass
  • Electro plating
  • Flip chip
  • Nonconductive adhesive
  • Tin bump

Cite this

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Non-conductive adhesive (NCA) trapping study in chip on glass joints fabricated using Sn bumps and NCA. / Lee, Sang Mok; Kim, Byeung Gee; Kim, Young Ho.

In: Materials Transactions, Vol. 49, No. 9, 01.09.2008, p. 2100-2106.

Research output: Contribution to journalArticle

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