Mechanical properties of porcelain with thermally and chemically induced residual stress on glaze

Dong Hwan Kim, Jee Hun Maeng, Yoon Soo Han, Hyung Tae Kim, Sung Churl Choi, Hyeong Jun Kim

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

In this study, we measured the thermally and chemically induced residual stresses on glaze using the photoelastic method. Porcelain with thermally induced residual stress showed compressive stress of 49 MPa for thermal expansion mismatch and a locally fluctuated stress field over the glaze layer due to compensation of compressive stresses around pores. In the case of chemically strengthened porcelain, the compressive stress on the glaze was 151 MPa which was around 3 times higher than the stress on thermally strengthened glaze. The trend of fracture strength of thermally and chemically strengthened porcelains was coincident with that of the residual stress of porcelains.

Original languageEnglish
Pages (from-to)487-491
Number of pages5
JournalJournal of the Korean Ceramic Society
Volume51
Issue number5
DOIs
StatePublished - 2014 Sep 30

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Glazes
Dental Porcelain
Porcelain
Residual stresses
Compressive stress
Mechanical properties
Thermal expansion
Fracture toughness

Keywords

  • Chemical strengthening
  • Glaze
  • Photoelasticity
  • Residual stress

Cite this

Kim, Dong Hwan ; Maeng, Jee Hun ; Han, Yoon Soo ; Kim, Hyung Tae ; Choi, Sung Churl ; Kim, Hyeong Jun. / Mechanical properties of porcelain with thermally and chemically induced residual stress on glaze. In: Journal of the Korean Ceramic Society. 2014 ; Vol. 51, No. 5. pp. 487-491.
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Mechanical properties of porcelain with thermally and chemically induced residual stress on glaze. / Kim, Dong Hwan; Maeng, Jee Hun; Han, Yoon Soo; Kim, Hyung Tae; Choi, Sung Churl; Kim, Hyeong Jun.

In: Journal of the Korean Ceramic Society, Vol. 51, No. 5, 30.09.2014, p. 487-491.

Research output: Contribution to journalArticle

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T1 - Mechanical properties of porcelain with thermally and chemically induced residual stress on glaze

AU - Kim, Dong Hwan

AU - Maeng, Jee Hun

AU - Han, Yoon Soo

AU - Kim, Hyung Tae

AU - Choi, Sung Churl

AU - Kim, Hyeong Jun

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AB - In this study, we measured the thermally and chemically induced residual stresses on glaze using the photoelastic method. Porcelain with thermally induced residual stress showed compressive stress of 49 MPa for thermal expansion mismatch and a locally fluctuated stress field over the glaze layer due to compensation of compressive stresses around pores. In the case of chemically strengthened porcelain, the compressive stress on the glaze was 151 MPa which was around 3 times higher than the stress on thermally strengthened glaze. The trend of fracture strength of thermally and chemically strengthened porcelains was coincident with that of the residual stress of porcelains.

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