Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

Sung Jun Joo, Buhm Park, Do Hyoung Kim, Dong Ok Kwak, In Sang Song, Junhong Park, Hak Sung Kim

Research output: Contribution to journalArticle

8 Scopus citations

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Chemical Compounds

Engineering & Materials Science