Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation

Seung Hwan Chang, Hak-Sung Kim

Research output: Contribution to journalArticle

14 Scopus citations


Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common failure phenomena that occur during the solder reflow process in the semiconductor industry. Therefore, the hygroscopic properties of the package materials are crucial factors in the reliability of electronic packaging products. In this work, molecular dynamics (MD) simulation was performed to study the hygroscopic properties, including diffusivity and swelling strain, of epoxy materials with respect to temperature and moisture concentration. Hygroscopic material properties predicted by MD are discussed and compared with the experimental data.

Original languageEnglish
Pages (from-to)3437-3442
Number of pages6
Issue number15
Publication statusPublished - 2011 Jul 7



  • Hygroscopic characteristic
  • Molecular dynamics
  • Swelling

Cite this