Intermetallic formation between Sn-Ag(-Cu) solder bumps and Au/Ni/Ti UBM and it's effects on the shear force of the solder bumps

Se Hoon Park, Young Ho Kim

Research output: Contribution to journalConference article

Abstract

The shear force of Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder bumps formed by the stencil printing method was measured and the effects of intermetallic formation on the shear force of solder bumps were investigated. The Sn-Ag(-Cu) solder paste was printed on the Au/Ni/Ti under bump metallurgy (UBM) and then reflowed repeatedly. The shear force of the solder bumps was measured as a function of the reflow times. The intermetallic formation in the Sn-Ag(-Cu) solder/UBM was characterized using scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS) and x-ray diffractormeter Ni3Sn4 phase was formed in the Sn-3.5Ag solder/UBM interface and (Cu,Ni)6Sn 5 phase formed at the Sn-3.8Sg-0.7Cu solder/UBM interface. The shear force of solder bumps was sensitive to the depletion of Ni layer and the intermetallic thickness at the solder/Ni interface. The shear forces of Sn-3.5 Ag solder bumps decreased rapidly after the fifth reflow due to the depletion of Ni layer in the UBM. The shear forces of Sn-3.8Ag-0.7Cu solder bumps decreased after the tenth reflow due to extensive growth of intermetallic layer in the solder/Ni interface.

Original languageEnglish
Pages (from-to)1881-1884
Number of pages4
JournalMaterials Science Forum
Volume475-479
Issue numberIII
StatePublished - 2005 Apr 25
EventPRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing - Beijing, China
Duration: 2004 Nov 22004 Nov 5

Fingerprint

metallurgy
Metallurgy
solders
Soldering alloys
Intermetallics
intermetallics
shear
titanium nickelide
depletion
X rays
Ointments
printing
x ray spectroscopy
Printing
Energy dispersive spectroscopy

Keywords

  • Intermetallic compound
  • Shear force
  • Sn-3.5Ag solder
  • Sn-3.8Ag-0.7Cu solder

Cite this

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title = "Intermetallic formation between Sn-Ag(-Cu) solder bumps and Au/Ni/Ti UBM and it's effects on the shear force of the solder bumps",
abstract = "The shear force of Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder bumps formed by the stencil printing method was measured and the effects of intermetallic formation on the shear force of solder bumps were investigated. The Sn-Ag(-Cu) solder paste was printed on the Au/Ni/Ti under bump metallurgy (UBM) and then reflowed repeatedly. The shear force of the solder bumps was measured as a function of the reflow times. The intermetallic formation in the Sn-Ag(-Cu) solder/UBM was characterized using scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS) and x-ray diffractormeter Ni3Sn4 phase was formed in the Sn-3.5Ag solder/UBM interface and (Cu,Ni)6Sn 5 phase formed at the Sn-3.8Sg-0.7Cu solder/UBM interface. The shear force of solder bumps was sensitive to the depletion of Ni layer and the intermetallic thickness at the solder/Ni interface. The shear forces of Sn-3.5 Ag solder bumps decreased rapidly after the fifth reflow due to the depletion of Ni layer in the UBM. The shear forces of Sn-3.8Ag-0.7Cu solder bumps decreased after the tenth reflow due to extensive growth of intermetallic layer in the solder/Ni interface.",
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Intermetallic formation between Sn-Ag(-Cu) solder bumps and Au/Ni/Ti UBM and it's effects on the shear force of the solder bumps. / Park, Se Hoon; Kim, Young Ho.

In: Materials Science Forum, Vol. 475-479, No. III, 25.04.2005, p. 1881-1884.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Intermetallic formation between Sn-Ag(-Cu) solder bumps and Au/Ni/Ti UBM and it's effects on the shear force of the solder bumps

AU - Park, Se Hoon

AU - Kim, Young Ho

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Y1 - 2005/4/25

N2 - The shear force of Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder bumps formed by the stencil printing method was measured and the effects of intermetallic formation on the shear force of solder bumps were investigated. The Sn-Ag(-Cu) solder paste was printed on the Au/Ni/Ti under bump metallurgy (UBM) and then reflowed repeatedly. The shear force of the solder bumps was measured as a function of the reflow times. The intermetallic formation in the Sn-Ag(-Cu) solder/UBM was characterized using scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS) and x-ray diffractormeter Ni3Sn4 phase was formed in the Sn-3.5Ag solder/UBM interface and (Cu,Ni)6Sn 5 phase formed at the Sn-3.8Sg-0.7Cu solder/UBM interface. The shear force of solder bumps was sensitive to the depletion of Ni layer and the intermetallic thickness at the solder/Ni interface. The shear forces of Sn-3.5 Ag solder bumps decreased rapidly after the fifth reflow due to the depletion of Ni layer in the UBM. The shear forces of Sn-3.8Ag-0.7Cu solder bumps decreased after the tenth reflow due to extensive growth of intermetallic layer in the solder/Ni interface.

AB - The shear force of Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder bumps formed by the stencil printing method was measured and the effects of intermetallic formation on the shear force of solder bumps were investigated. The Sn-Ag(-Cu) solder paste was printed on the Au/Ni/Ti under bump metallurgy (UBM) and then reflowed repeatedly. The shear force of the solder bumps was measured as a function of the reflow times. The intermetallic formation in the Sn-Ag(-Cu) solder/UBM was characterized using scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS) and x-ray diffractormeter Ni3Sn4 phase was formed in the Sn-3.5Ag solder/UBM interface and (Cu,Ni)6Sn 5 phase formed at the Sn-3.8Sg-0.7Cu solder/UBM interface. The shear force of solder bumps was sensitive to the depletion of Ni layer and the intermetallic thickness at the solder/Ni interface. The shear forces of Sn-3.5 Ag solder bumps decreased rapidly after the fifth reflow due to the depletion of Ni layer in the UBM. The shear forces of Sn-3.8Ag-0.7Cu solder bumps decreased after the tenth reflow due to extensive growth of intermetallic layer in the solder/Ni interface.

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KW - Sn-3.8Ag-0.7Cu solder

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