Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film

Cheol Ho Joh, Young Ho Kim

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50, and 100 mtorr. The microstructure was characterized using SEM and TEM. The adhesion strength between Cu/Cr and polyimide was measured using a modified T-peel test. Plastic deformation of the peeled metal was qualitatively measured using the XRD technique. The Cu film sputtered at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As sputtering pressure increases, open boundaries are observed more frequently. The peel adhesion strength of Cr film to polyimide increases with Cu sputtering pressure. The adhesion change of Cu/Cr film can be interpreted as the difference in plastic deformation. Open boundaries in the Cu film seem to play an important role in increasing the amount of plastic deformation in the metal film during peeling.

Original languageEnglish
Title of host publicationThin Films
Subtitle of host publicationStresses and Mechanical Properties VI
EditorsW.W. Gerberich, H. Gao, J.E. Sundgren, S.P. Baker
StatePublished - 1996 Dec 1
EventProceedings of the 1996 MRS Spring Meeting - San Francisco, CA, USA
Duration: 1996 Apr 81996 Apr 12

Publication series

NameMaterials Research Society Symposium - Proceedings
Volume436
ISSN (Print)0272-9172

Other

OtherProceedings of the 1996 MRS Spring Meeting
CitySan Francisco, CA, USA
Period96/04/896/04/12

Fingerprint

polyimides
Polyimides
adhesion
Adhesion
Thin films
microstructure
Microstructure
thin films
Bond strength (materials)
plastic deformation
Plastic deformation
Sputtering
sputtering
Metals
peeling
Peeling
metal films
Magnetron sputtering
magnetron sputtering
direct current

Cite this

Joh, C. H., & Kim, Y. H. (1996). Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film. In W. W. Gerberich, H. Gao, J. E. Sundgren, & S. P. Baker (Eds.), Thin Films: Stresses and Mechanical Properties VI (Materials Research Society Symposium - Proceedings; Vol. 436).
Joh, Cheol Ho ; Kim, Young Ho. / Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film. Thin Films: Stresses and Mechanical Properties VI. editor / W.W. Gerberich ; H. Gao ; J.E. Sundgren ; S.P. Baker. 1996. (Materials Research Society Symposium - Proceedings).
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abstract = "The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50, and 100 mtorr. The microstructure was characterized using SEM and TEM. The adhesion strength between Cu/Cr and polyimide was measured using a modified T-peel test. Plastic deformation of the peeled metal was qualitatively measured using the XRD technique. The Cu film sputtered at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As sputtering pressure increases, open boundaries are observed more frequently. The peel adhesion strength of Cr film to polyimide increases with Cu sputtering pressure. The adhesion change of Cu/Cr film can be interpreted as the difference in plastic deformation. Open boundaries in the Cu film seem to play an important role in increasing the amount of plastic deformation in the metal film during peeling.",
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Joh, CH & Kim, YH 1996, Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film. in WW Gerberich, H Gao, JE Sundgren & SP Baker (eds), Thin Films: Stresses and Mechanical Properties VI. Materials Research Society Symposium - Proceedings, vol. 436, Proceedings of the 1996 MRS Spring Meeting, San Francisco, CA, USA, 96/04/8.

Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film. / Joh, Cheol Ho; Kim, Young Ho.

Thin Films: Stresses and Mechanical Properties VI. ed. / W.W. Gerberich; H. Gao; J.E. Sundgren; S.P. Baker. 1996. (Materials Research Society Symposium - Proceedings; Vol. 436).

Research output: Chapter in Book/Report/Conference proceedingChapter

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N2 - The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50, and 100 mtorr. The microstructure was characterized using SEM and TEM. The adhesion strength between Cu/Cr and polyimide was measured using a modified T-peel test. Plastic deformation of the peeled metal was qualitatively measured using the XRD technique. The Cu film sputtered at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As sputtering pressure increases, open boundaries are observed more frequently. The peel adhesion strength of Cr film to polyimide increases with Cu sputtering pressure. The adhesion change of Cu/Cr film can be interpreted as the difference in plastic deformation. Open boundaries in the Cu film seem to play an important role in increasing the amount of plastic deformation in the metal film during peeling.

AB - The microstructure of Cu thin films in various deposition conditions and the influence of their microstructure on the adhesion strength between Cu/Cr films and polyimides were studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50, and 100 mtorr. The microstructure was characterized using SEM and TEM. The adhesion strength between Cu/Cr and polyimide was measured using a modified T-peel test. Plastic deformation of the peeled metal was qualitatively measured using the XRD technique. The Cu film sputtered at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As sputtering pressure increases, open boundaries are observed more frequently. The peel adhesion strength of Cr film to polyimide increases with Cu sputtering pressure. The adhesion change of Cu/Cr film can be interpreted as the difference in plastic deformation. Open boundaries in the Cu film seem to play an important role in increasing the amount of plastic deformation in the metal film during peeling.

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Joh CH, Kim YH. Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film. In Gerberich WW, Gao H, Sundgren JE, Baker SP, editors, Thin Films: Stresses and Mechanical Properties VI. 1996. (Materials Research Society Symposium - Proceedings).