Effect of heating rate on transient liquid phase diffusion bonding of Ni-based superalloy GTD-111

Woohyuk Choi, Sungwook Kim, Changhee Lee, Jungcheol Jang

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

This study was carried out to investigate the effect of heating rate on dissolution and solidification behavior during transient liquid phase diffusion bonding of Ni-based superalloy GTD-111. The heating rate was varied by 0.1K/sec, 1K/sec, 10K/sec to the bonding temperatures 1373K and 1423K in vacuum. When the heating rate was slower and the bonding temperature was higher, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification was shorter. However, when the total time required for completion of solidification from the beginning of heating was considered, heating at O.1K/sec was nearly the same as heating at 10K/sec.

Original languageEnglish
Pages (from-to)133-136
Number of pages4
JournalMaterials Science Forum
Volume449-452
Issue numberI
DOIs
StatePublished - 2004 Jan 1
EventDesigning, Processing and Properties of Advanced Engineering Materials: Proceedings on the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials - Jeju Island, Korea, Republic of
Duration: 2003 Nov 52003 Nov 8

Keywords

  • Dissolution
  • Equiaxed Ni-based superalloy
  • GTD-111
  • Heating rate
  • Isothermal solidification
  • Transient Liquid Phase Diffusion Bonding

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