Double-sided nickel-tin transient liquid phase bonding for double-sided cooling

Sang Won Yoon, Koji Shiozaki, Takehiro Kato

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

This paper presents double-sided nickel-tin transient liquid phase (Ni-Sn TLP) bonding technology and its application to double-sided cooling structures used in automotive power modules. Double-sided cooling is an emerging solution for heat dissipation problems inside compact power modules (used in electrified vehicles) and requires components providing highlevel reliability. This requirement is satisfied by Ni-Sn TLP bonding technology facilitating a high re-melting temperature reaching ∼794 °C. Double-sided Ni-Sn TLP bonding is demonstrated using conventional power diodes having nickel layers on both sides. Electrical characterizations of the doubleside bonded diodes reveal consistent and reproducible bonding quality. In addition, excellent high temperature reliability of double-sided TLP bonding is exhibited by high temperature storage (at 300 °C) and thermal cycling (from -40 to 200 °C) evaluations. This presentation is the first time demonstration of double-sided TLP bonding using active power devices.

Original languageEnglish
Title of host publicationAPEC 2014 - 29th Annual IEEE Applied Power Electronics Conference and Exposition
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages527-530
Number of pages4
ISBN (Print)9781479923250
DOIs
StatePublished - 2014 Jan 1
Event29th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2014 - Fort Worth, TX, United States
Duration: 2014 Mar 162014 Mar 20

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Other

Other29th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2014
CountryUnited States
CityFort Worth, TX
Period14/03/1614/03/20

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Yoon, S. W., Shiozaki, K., & Kato, T. (2014). Double-sided nickel-tin transient liquid phase bonding for double-sided cooling. In APEC 2014 - 29th Annual IEEE Applied Power Electronics Conference and Exposition (pp. 527-530). [6803359] (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2014.6803359