A system-on-package module by embedding a mobile TV IC in printed-circuit-board

Jong In Ryu, Se Hoon Park, Dongsu Kim, Jun Chul Kim, Hyeongdong Kim, Jong Chul Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This paper presents a compact module for a mobile TV by using system-on-package (SoP) technology. In order to implement a slim and compact module, a mobile TV chip is embedded in printed-circuit-board (PCB) and other components are mounted in PCB. This module is composed of a mobile TV IC, a BPF, a crystal, regulators, shunt capacitors, and a loop filter. This module uses lamination process by using polymer substrates. Polymer substrate consists of epoxy core and ajimo-to-bonding film (ABF) to bond each layer. Three times lamination and via drill/Cu plated are proposed. Test method for an embedded IC is introduced and tested. DC bias, reference clock, PLL locking, and so on are measured. Two mobile TV modules by using surface mounting technology (SMT) and SoP technology are designed and compared. The size of module with SMT and SoP are as 6.8 mm 6.6 mm 0.9 mm and 4.7 mm 4.7 mm 1.0 mm, respectively. Almost 46 % size reduction is obtained by SoP. Rx sensitivity is measured as 89 dBm. As a result, a presented module shows the possibility of an embedded active IC, compact size, and good performance.

Original languageEnglish
Title of host publicationRWW 2012 - Proceedings
Subtitle of host publicationIEEE Radio and Wireless Symposium, RWS 2012
Pages283-286
Number of pages4
DOIs
StatePublished - 2012 May 11
Event2012 6th IEEE Radio and Wireless Week, RWW 2012 - 2012 IEEE Radio and Wireless Symposium, RWS 2012 - Santa Clara, CA, United States
Duration: 2012 Jan 152012 Jan 18

Other

Other2012 6th IEEE Radio and Wireless Week, RWW 2012 - 2012 IEEE Radio and Wireless Symposium, RWS 2012
CountryUnited States
CitySanta Clara, CA
Period12/01/1512/01/18

Keywords

  • embedded module
  • embedding chip component
  • mobile TV
  • system-in-package
  • System-on-package

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    Ryu, J. I., Park, S. H., Kim, D., Kim, J. C., Kim, H., & Park, J. C. (2012). A system-on-package module by embedding a mobile TV IC in printed-circuit-board. In RWW 2012 - Proceedings: IEEE Radio and Wireless Symposium, RWS 2012 (pp. 283-286). [6175313] https://doi.org/10.1109/RWS.2012.6175313