A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties

Hwan Pil Park, Jae Yong Park, Gwancheol Seo, Young-Ho Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We propose a new process utilizing back-side under bump metallurgy to improve die shift and enhance the thermal properties of advanced fan-out package applications. Using a back-sided UBM pad and molten solder, the pick-and-placed dies were spontaneously aligned on the substrate pad during reflow. Four kinds of UBMs were prepared on glass dies, and SAC305 solder was formed on the Cu and ENEPIG pads of an FR-4 based substrate. The die shift value ranged from 20 to 50 μm after the pick-and-place step. After reflow, the max die shift value was less than 1 μm. The initially misaligned die with the large shift was aligned with high accuracy during reflow due to the surface tension of the molten solder. The thermal diffusivity and thermal conductivity on the Cu and the ENEPIG substrate ranged from 10.0 to 10.3 mm2/s and 11.2 to 11.5 W/mK, respectively. The measurement complied with the standards of the American Society of Testing Materials and the laser flash analyzer method. This newly proposed process can improve the die shift in fan-out wafer level packaging and can be extended to panel level packaging embedded with an active die. Additionally, this interconnected solder with a back-side UBM can be used as a heat-transfer path for advanced AP package applications.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2212-2217
Number of pages6
ISBN (Electronic)9781509043323
DOIs
StatePublished - 2017 Aug 1
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: 2017 May 302017 Jun 2

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista
Period17/05/3017/06/2

Fingerprint

Soldering alloys
Fans
Molten materials
Thermodynamic properties
Packaging
Substrates
Materials testing
Thermal diffusivity
Metallurgy
Surface tension
Thermal conductivity
Heat transfer
Glass
Lasers

Keywords

  • Back-side under bump metallurgy
  • Die shift
  • Fan-out package
  • Heat dissipation

Cite this

Park, H. P., Park, J. Y., Seo, G., & Kim, Y-H. (2017). A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties. In Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017 (pp. 2212-2217). [7999989] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2017.148
Park, Hwan Pil ; Park, Jae Yong ; Seo, Gwancheol ; Kim, Young-Ho. / A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties. Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 2212-2217 (Proceedings - Electronic Components and Technology Conference).
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abstract = "We propose a new process utilizing back-side under bump metallurgy to improve die shift and enhance the thermal properties of advanced fan-out package applications. Using a back-sided UBM pad and molten solder, the pick-and-placed dies were spontaneously aligned on the substrate pad during reflow. Four kinds of UBMs were prepared on glass dies, and SAC305 solder was formed on the Cu and ENEPIG pads of an FR-4 based substrate. The die shift value ranged from 20 to 50 μm after the pick-and-place step. After reflow, the max die shift value was less than 1 μm. The initially misaligned die with the large shift was aligned with high accuracy during reflow due to the surface tension of the molten solder. The thermal diffusivity and thermal conductivity on the Cu and the ENEPIG substrate ranged from 10.0 to 10.3 mm2/s and 11.2 to 11.5 W/mK, respectively. The measurement complied with the standards of the American Society of Testing Materials and the laser flash analyzer method. This newly proposed process can improve the die shift in fan-out wafer level packaging and can be extended to panel level packaging embedded with an active die. Additionally, this interconnected solder with a back-side UBM can be used as a heat-transfer path for advanced AP package applications.",
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Park, HP, Park, JY, Seo, G & Kim, Y-H 2017, A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties. in Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017., 7999989, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 2212-2217, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, Lake Buena Vista, United States, 17/05/30. https://doi.org/10.1109/ECTC.2017.148

A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties. / Park, Hwan Pil; Park, Jae Yong; Seo, Gwancheol; Kim, Young-Ho.

Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 2212-2217 7999989 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - We propose a new process utilizing back-side under bump metallurgy to improve die shift and enhance the thermal properties of advanced fan-out package applications. Using a back-sided UBM pad and molten solder, the pick-and-placed dies were spontaneously aligned on the substrate pad during reflow. Four kinds of UBMs were prepared on glass dies, and SAC305 solder was formed on the Cu and ENEPIG pads of an FR-4 based substrate. The die shift value ranged from 20 to 50 μm after the pick-and-place step. After reflow, the max die shift value was less than 1 μm. The initially misaligned die with the large shift was aligned with high accuracy during reflow due to the surface tension of the molten solder. The thermal diffusivity and thermal conductivity on the Cu and the ENEPIG substrate ranged from 10.0 to 10.3 mm2/s and 11.2 to 11.5 W/mK, respectively. The measurement complied with the standards of the American Society of Testing Materials and the laser flash analyzer method. This newly proposed process can improve the die shift in fan-out wafer level packaging and can be extended to panel level packaging embedded with an active die. Additionally, this interconnected solder with a back-side UBM can be used as a heat-transfer path for advanced AP package applications.

AB - We propose a new process utilizing back-side under bump metallurgy to improve die shift and enhance the thermal properties of advanced fan-out package applications. Using a back-sided UBM pad and molten solder, the pick-and-placed dies were spontaneously aligned on the substrate pad during reflow. Four kinds of UBMs were prepared on glass dies, and SAC305 solder was formed on the Cu and ENEPIG pads of an FR-4 based substrate. The die shift value ranged from 20 to 50 μm after the pick-and-place step. After reflow, the max die shift value was less than 1 μm. The initially misaligned die with the large shift was aligned with high accuracy during reflow due to the surface tension of the molten solder. The thermal diffusivity and thermal conductivity on the Cu and the ENEPIG substrate ranged from 10.0 to 10.3 mm2/s and 11.2 to 11.5 W/mK, respectively. The measurement complied with the standards of the American Society of Testing Materials and the laser flash analyzer method. This newly proposed process can improve the die shift in fan-out wafer level packaging and can be extended to panel level packaging embedded with an active die. Additionally, this interconnected solder with a back-side UBM can be used as a heat-transfer path for advanced AP package applications.

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M3 - Conference contribution

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EP - 2217

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PB - Institute of Electrical and Electronics Engineers Inc.

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Park HP, Park JY, Seo G, Kim Y-H. A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties. In Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 2212-2217. 7999989. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2017.148