• 1880 Citations
  • 21 h-Index
1987 …2019
If you made any changes in Pure, your changes will be visible here soon.

Research Output 1987 2019

Filter
Conference article
2005
1 Citation (Scopus)

Cu oxide nanoparticle formation; Effect of curing time

Song, M. S., Yoon, C. S. & Kim, Y-H., 2005 Apr 25, In : Materials Science Forum. 475-479, V, p. 3555-3558 4 p.

Research output: Contribution to journalConference article

curing
Polyimides
Oxides
Curing
Nanoparticles
14 Citations (Scopus)

Electrical properties of metal-oxide semiconductor nano-particle device

Kim, J. H., Kim, E. K., Lee, C. H., Song, M. S., Kim, Y-H. & Kim, J., 2005 Feb 1, In : Physica E: Low-Dimensional Systems and Nanostructures. 26, 1-4, p. 432-435 4 p.

Research output: Contribution to journalConference article

Polyimides
metal oxide semiconductors
Electric properties
Electron tunneling
Metals

Intermetallic formation between Sn-Ag(-Cu) solder bumps and Au/Ni/Ti UBM and it's effects on the shear force of the solder bumps

Park, S. H. & Kim, Y-H., 2005 Apr 25, In : Materials Science Forum. 475-479, III, p. 1881-1884 4 p.

Research output: Contribution to journalConference article

metallurgy
Metallurgy
solders
Soldering alloys
Intermetallics
2004
4 Citations (Scopus)

Comparison of metal-oxide nanoparticle formation in the Cu and Sn thin films by the reaction with polyimide

Park, H. P., Chung, Y., Yoon, C. S., Jo, S. S. & Kim, Y-H., 2004 Jul 26, In : Materials Science Forum. 449-452, II, p. 1237-1240 4 p.

Research output: Contribution to journalConference article

polyimides
Polyimides
Oxides
metal oxides
Metals
6 Citations (Scopus)

Electrical characteristics of fine pitch flip chip solder joints fabricated using low temperature solders

Kang, U. B. & Kim, Y-H., 2004 Dec 27, In : Proceedings - Electronic Components and Technology Conference. 2, p. 1952-1958 7 p.

Research output: Contribution to journalConference article

Soldering alloys
Contact resistance
Eutectics
Temperature
Wet etching
12 Citations (Scopus)

Synthesis of ZnO nanoparticles embedded in a polymeric matrix; Effect of curing temperature

Jeon, H. J., Chung, Y., Kim, S. Y., Yoon, C. S. & Kim, Y-H., 2004 Jul 26, In : Materials Science Forum. 449-452, II, p. 1145-1148 4 p.

Research output: Contribution to journalConference article

curing
polyimides
Curing
Polyimides
Nanoparticles
2001
5 Citations (Scopus)
textures
Textures
Thin films
microstructure
Microstructure
1987

Conductive copolymers of alkylthiophenes and methylmethacrylate

Huang, W. S., Kim, Y-H. & Park, J. M., 1987 Dec 1, In : International SAMPE Symposium and Exhibition (Proceedings). 1, p. 180-187 8 p.

Research output: Contribution to journalConference article

Methylmethacrylate
Copolymers
Conducting polymers
Polymers
Peeling