• 1880 Citations
  • 21 h-Index
1987 …2019
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Research Output 1987 2019

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Conference contribution
2018

Controlling die warpage by applying under bump metallurgy for fan-out package process applications

Park, H. P., Kim, Y-H., Jang, Y. M. & Choa, S. H., 2018 Aug 7, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1912-1919 8 p. 8429799. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallurgy
Fans
Polyimides
Soldering alloys
Copper
1 Citation (Scopus)

The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA)

Park, H. P., Kim, S., Lee, T., Yoo, S., Kim, Y-H. & Park, J. Y. P., 2018 Aug 7, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1937-1941 5 p. 8429803. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Adhesives
Compaction
Acoustic impedance
Temperature
2017
3 Citations (Scopus)

A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties

Park, H. P., Park, J. Y., Seo, G. & Kim, Y-H., 2017 Aug 1, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 2212-2217 6 p. 7999989. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fans
Molten materials
Thermodynamic properties
Packaging
2013
1 Citation (Scopus)

An eco-friendly Cu-Zn wetting layer for highly reliable solder joints

Kim, Y. M., Kim, S. C. & Kim, Y-H., 2013 Sep 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 755-760 6 p. 6575657

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Wetting
Cyanides
Thermal cycling
Electroplating
1 Citation (Scopus)

Development of highly reliable flip-chip bonding technology using non-conductive adhesives (NCAs) for 20 μm pitch application

Kim, S. C., Hong, M. H., Lee, J. H. & Kim, Y-H., 2013 Sep 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 785-789 5 p. 6575662. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesives
Electronics packaging
Thermal cycling
Contact resistance
Thermal expansion
2012

Development of low temperature Chip-on-Flex (COF) bonding process of 100°C

Kim, S. C. & Kim, Y-H., 2012 Dec 1, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507904. (14th International Conference on Electronic Materials and Packaging, EMAP 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Contact resistance
Temperature
Compaction
Conductive films
Domes
2 Citations (Scopus)

Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates

Hwang, J. H., Kim, Y. M., Kim, T. J., Kim, Y-H. & Lee, W. J., 2012 Dec 1, ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. p. 426-429 4 p. 6474650

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Aging of materials
Substrates
Thermal aging
2011

Fabrication of copper nanoparticles in 6FDA-ODA polyimide film

Choi, D. J., Ahnn, K. O., Choi, M. Y. & Kim, Y-H., 2011 Dec 1, 2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011. 1 p. 6155281. (2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Copper
Nanoparticles
Fabrication
Curing

Study on transparent and flexible memory with metal-oxide nanocrystals

Lee, D. U., Kim, S. P., Lee, H. J., Han, D. S., Kim, E. K., You, H. W., Cho, W. J. & Kim, Y-H., 2011 Dec 1, Physics of Semiconductors - 30th International Conference on the Physics of Semiconductors, ICPS-30. p. 869-870 2 p. (AIP Conference Proceedings; vol. 1399).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

metal oxides
nanocrystals
diamines
polyimides
transmittance
2010
5 Citations (Scopus)

A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application

Cho, H. Y., Kim, T. J., Kim, Y. M., Kim, S. C., Park, J. Y. & Kim, Y-H., 2010 Aug 9, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 151-155 5 p. 5490894

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallurgy
Intermetallics
Soldering alloys
Lead-free solders
Aging of materials
2 Citations (Scopus)

Fabrication and characterization of embedded active and passive device for wireless application

Park, S. H., Ryu, J. I., Kim, J. C., Kang, N. K., Park, J. C. & Kim, Y-H., 2010 Aug 9, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 2035-2041 7 p. 5490663. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polychlorinated Biphenyls
Polychlorinated biphenyls
Polymers
Fabrication
Intermetallics
1 Citation (Scopus)

Formation of Cu or Cu2O nanoparticles embedded in a polyimide film for nanofloating gate memory

Choi, D. J. & Kim, Y-H., 2010 May 5, INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings. p. 244-245 2 p. 5424661. (INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Nanoparticles
Data storage equipment
Electrodes
Hybrid materials

The reliability of COF joints with tin bumps and non-conductive adhesives for image sensor module application

Lee, C. B., Kim, J. G., Kweon, Y. D., Harr, K. M. & Kim, Y-H., 2010 Dec 1, 43rd International Symposium on Microelectronics 2010, IMAPS 2010. p. 736-741 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Image sensors
Tin
Adhesives
Contact resistance
Aging of materials
2009
9 Citations (Scopus)

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

Harr, K. M., Kim, Y. M., Lim, D. H., Kim, Y-H., Kim, J. G. & Yi, S., 2009 Oct 12, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 1475-1478 4 p. 5074207. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Image sensors
Adhesives
Packaging
Contact resistance
Thermal cycling
14 Citations (Scopus)

A New Cu-Zn Solder Wetting Layer for Improved Impact Reliability

Kim, Y. M., Oh, C. Y., Roh, H. R. & Kim, Y. H., 2009 Oct 12, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 1008-1013 6 p. 5074135. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Wetting
Intermetallics
Aging of materials
Shear strength
3 Citations (Scopus)

Chip to chip bonding using micro-Cu bumps with Sn capping layers

Lee, J. S., Byun, K. Y., Chung, Q. H., Suh, M. S., Kim, S. C. & Kim, Y-H., 2009 Nov 25, 2009 European Microelectronics and Packaging Conference, EMPC 2009. 5272982. (2009 European Microelectronics and Packaging Conference, EMPC 2009).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shear strength
Soldering alloys
Microstructure
Joining
Aging of materials
2008
4 Citations (Scopus)

Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

Kim, Y. M. & Kim, Y. H., 2008 Dec 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 236-238 3 p. 4784272. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Aging of materials
Wetting
Printed circuit boards
Intermetallics
2007
1 Citation (Scopus)

Chip-to-chip interconnection by mechanical caulking using reflowed Sn bumps

Yang, J. H., Kim, Y-H., Moon, J. S. & Lee, W. J., 2007 Dec 1, Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 4441380

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Contact resistance
Soldering alloys
Electrodes
Temperature

Fabrication of nonvolatile nano-floating gate memory with self-assembled metal-oxide nano-particles embedded in polyimide

Kim, S. P., Lee, T. H., Lee, D. U., Kim, E. K., Koo, H. M., Cho, W. J. & Kim, Y-H., 2007 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 134-135 2 p. 4456140

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Data storage equipment
Fabrication
Oxides
Metals
1 Citation (Scopus)

Flip chip process using mushroom bumps and interlocking bumps

Park, S. H., Lee, K. Y., Won, H. J., Oh, T. S. & Kim, Y-H., 2007 Dec 1, Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007. p. 723-727 5 p. (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Contact resistance
Conductive films
Electrodeposition
Melting
Surface roughness
6 Citations (Scopus)

Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu-Zn alloy UBM

Oh, C. Y., Roh, H. R. & Kim, Y. H., 2007 Dec 1, Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007. p. 48-51 4 p. (Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Thermal aging
Lead-free solders
Soldering
2 Citations (Scopus)

Intermetallic compound formation and solder joint reliability of Sn-Ag-Cu solder ball on Cu-Zn substrate

Roh, H. R. & Kim, Y-H., 2007 Dec 1, EMAP 2007- International Conference on Electronic Materials and Packaging 2007. 4510294

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Substrates
Aging of materials
Soldering
7 Citations (Scopus)

Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

Kim, S. Y., Oh, T. S., Lee, W. J. & Kim, Y-H., 2007 Oct 11, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06. 4198903

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Contact resistance
adhesives
Adhesives
Glass bonding
Aging of materials

Optical properties of ZnO nanocrystals embedded in a polyimide layer

Li, F., Son, D. I., Leem, J. H., Jung, J. H., Kim, T. & Kim, Y-H., 2007 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 226-227 2 p. 4456186. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Nanocrystals
Optical properties
Defects
Vacancies

The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps

Yang, J. H., Kim, Y-H., Moon, J. S. & Lee, W. J., 2007 Dec 1, EMAP 2007- International Conference on Electronic Materials and Packaging 2007. 4510303

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Electric properties
Contact resistance
Acoustic impedance
Plastic deformation
3 Citations (Scopus)

The reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive

Kim, B. G., Lee, S. M. & Kim, Y-H., 2007 Dec 1, EMAP 2007- International Conference on Electronic Materials and Packaging 2007. 4510304

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Glass bonding
Adhesives
Glass
Domes
Electroplating
2006

Charging and discharging mechanims of vertically stacked Ni 1-x Fe x self-assembled nanoparticle arrays embedded in polyimide layers

Jung, J. H., You, J. H., Kim, J. H., Kim, T., Yoon, C. S. & Kim, Y-H., 2006 Dec 1, 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC. p. 474-475 2 p. 4388823. (2006 IEEE Nanotechnology Materials and Devices Conference, NMDC; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Nanoparticles
Electric potential
Capacitance
Carrier concentration
2005

Characterization of nano-floating gate memory with ZnO nano-particles embedded in polymeric matrix

Kim, E. K., Kim, J-H., Lee, D. U., Kim, G. H. & Kim, Y-H., 2005 Dec 1, Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference. Vol. 2005. p. 180-181 2 p. 1595273

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Data storage equipment
Acids
Metals
Oxides

Low temperature fine pitch bonding on the flexible substrate with NCA applied

Chen, Z. & Kim, Y-H., 2005 Dec 1, Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005. p. 471-477 7 p. (Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Contact resistance
Polyethers
Adhesives
Substrates
Temperature

Preparation of ni nanoparticles mono-layer on polyimide substrate

Im, D. H., Chun, I. S., Ban, K. S., Lim, S. U., Jeon, K. S., Kim, J. W., Yoon, C. S., Kim, Y-H. & Kim, C. K., 2005 Dec 12, INTERMAG ASIA 2005: Digests of the IEEE International Magnetics Conference. 1 p. (INTERMAG ASIA 2005: Digests of the IEEE International Magnetics Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Nanoparticles
Substrates
2002

Electrical properties of ultrasmall low temperature solder joints for LCD driver IC packaging applications

Kang, U. B. & Kim, Y. H., 2002 Jan 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 356-359 4 p. 1188864. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liquid crystal displays
Soldering alloys
Packaging
Electric properties
Eutectics
2001
1 Citation (Scopus)

Adhesion of RF bias-sputtered Cr thin films onto photosensitive polyimide substrates

Kim, S. Y., Kim, Y-H. & Yoon, C. S., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 202-207 6 p. 983985

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Adhesion
Thin films
Substrates
Sputtering
7 Citations (Scopus)

A fine pitch COG technique using eutectic Bi-Sn solder joints for LCD driver IC packaging applications

Kang, U. B. & Kim, Y-H., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 129-134 6 p. 983971. (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liquid crystal displays
Soldering alloys
Eutectics
Packaging
Glass
5 Citations (Scopus)

A study on the nucleation behavior of zinc particles on aluminum substrate [flip-chip technology]

Lee, S. K., Jin, J. G., Kim, Y-H. & Lee, J. H., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 73-78 6 p. 983961. (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aluminum
Zinc
Nucleation
Substrates
Platelets
4 Citations (Scopus)

Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

Shin, M. S., Kim, Y-H., Do, W. C., Ha, S. H. & Min, B. Y., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 155-162 8 p. 983976

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shear strength
Soldering alloys
Intermetallics
Ointments
Printed circuit boards
5 Citations (Scopus)

Intermetallic growth between Sn-Ag-(Cu) solder and Ni

Yang, S. T., Chung, Y., Kim, Y-H., Hong, B. H., Park, K. R., Song, H. G. & Moris, J. W., 2001 Jan 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 219-224 6 p. 983988. (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
X ray diffraction analysis
Energy dispersive spectroscopy
Tapes