• 1880 Citations
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1987 …2019
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Research Output 1987 2019

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1996

Influence of Cu deposition conditions on the microstructure and adhesion of Cu/Cr thin film to polyimide film

Joh, C. H. & Kim, Y. H., 1996 Dec 1, Thin Films: Stresses and Mechanical Properties VI. Gerberich, W. W., Gao, H., Sundgren, J. E. & Baker, S. P. (eds.). (Materials Research Society Symposium - Proceedings; vol. 436).

Research output: Chapter in Book/Report/Conference proceedingChapter

polyimides
Polyimides
adhesion
Adhesion
Thin films