• 1921 Citations
  • 21 h-Index
1987 …2019
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Research Output 1987 2019

2019

Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints

Park, J. Y., Lee, T., Seo, W., Yoo, S. & Kim, Y-H., 2019 Jan 1, In : Journal of Materials Science: Materials in Electronics.

Research output: Contribution to journalArticle

Electromigration
electromigration
solders
Soldering alloys
Intermetallics

Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding

Park, J. Y., Lee, J. Y., Park, H. P., Kim, S. C., Lee, T. Y., Yoo, S. & Kim, Y-H., 2019 Aug 15, In : Microelectronic Engineering. 216, 110973.

Research output: Contribution to journalArticle

adhesives
Adhesives
Temperature
Acoustic impedance
electrical resistance

Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

Park, H. P., Seo, G., Kim, S., Ahn, K. O. & Kim, Y-H., 2019 Jun 15, In : Journal of Materials Science: Materials in Electronics. 30, 11, p. 10550-10559 10 p.

Research output: Contribution to journalArticle

shear strength
solders
fans
Shear strength
Soldering alloys
soldering
thermal shock
Void fraction
Soldering
Thermal shock
2018
1 Citation (Scopus)

A peel adhesion study of electroless Cu layers on polymer substrates

Kim, S. C., Seong, H., Ahn, K. O., Choi, D. J., Lee, J. Y., Ko, Y. J., Yoon, S. B., Seo, M. L. & Kim, Y-H., 2018 Jan 2, In : Journal of Adhesion. 94, 1, p. 1-14 14 p.

Research output: Contribution to journalArticle

Polymers
adhesion
Adhesion
polymers
Substrates

Controlling die warpage by applying under bump metallurgy for fan-out package process applications

Park, H. P., Kim, Y-H., Jang, Y. M. & Choa, S. H., 2018 Aug 7, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1912-1919 8 p. 8429799. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallurgy
Fans
Polyimides
Soldering alloys
Copper
1 Citation (Scopus)

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

Seo, W., Kim, K. H., Kim, Y. H. & Yoo, S., 2018 Jan 1, In : Journal of Electronic Materials. 47, 1, p. 110-116 7 p.

Research output: Contribution to journalArticle

solders
Nickel
plating
Plating
Gold
4 Citations (Scopus)

Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications

Park, H. P., Seo, G., Kim, S. & Kim, Y-H., 2018 Jan 1, In : Journal of Electronic Materials. 47, 1, p. 133-141 9 p.

Research output: Contribution to journalArticle

self alignment
solders
fans
Soldering alloys
Fans
1 Citation (Scopus)

The reliability and the effect of NCA trapping in thermo-compression flip-chip solder joints fabricated using Sn-Ag solder capped 40 μm Pitch Cu pillar bumps and low temperature curable non-conductive adhesive (NCA)

Park, H. P., Kim, S., Lee, T., Yoo, S., Kim, Y-H. & Park, J. Y. P., 2018 Aug 7, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1937-1941 5 p. 8429803. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Adhesives
Compaction
Acoustic impedance
Temperature
2017
6 Citations (Scopus)

Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment

Jang, M. S., Ma, S. W., Song, J., Sung, M. M. & Kim, Y-H., 2017 Nov 1, In : Microelectronics Reliability. 78, p. 220-226 7 p.

Research output: Contribution to journalArticle

oxygen plasma
adhesion
Adhesion
wafers
Oxygen
3 Citations (Scopus)

A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties

Park, H. P., Park, J. Y., Seo, G. & Kim, Y-H., 2017 Aug 1, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 2212-2217 6 p. 7999989. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fans
Molten materials
Thermodynamic properties
Packaging
1 Citation (Scopus)

Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments

Ahn, K. O., Park, S. H. & Kim, Y-H., 2017 Nov 1, In : Microelectronics Reliability. 78, p. 1-10 10 p.

Research output: Contribution to journalArticle

adhesion
Adhesion
degradation
Degradation
humidity
6 Citations (Scopus)

Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints

Park, J. Y., Seo, W., Yoo, S. & Kim, Y-H., 2017 Jan 1, In : Journal of Alloys and Compounds. 724, p. 492-500 9 p.

Research output: Contribution to journalArticle

Electroplating
Shear strength
Intermetallics
Soldering alloys
Thermal aging

Enhanced bonding by applied current in cu-To-cu joints fabricated using 20 lm cu microbumps

Ma, S. W., Shin, C. & Kim, Y-H., 2017 Dec 1, In : Journal of Electronic Packaging, Transactions of the ASME. 139, 4, 041004.

Research output: Contribution to journalArticle

Electromigration
Joule heating
Contact resistance
Shear strength
Temperature
2 Citations (Scopus)

Process enabling highly accurate die position for fan-out package applications

Park, H. P. & Kim, Y-H., 2017 Jun 8, In : Electronics Letters. 53, 12, p. 810-812 3 p.

Research output: Contribution to journalArticle

Fans
Metallurgy
Soldering alloys
Substrates
Surface tension
2016
3 Citations (Scopus)

Drop-shock reliability improvement of embedded chip resistor packages through via structure modification

Park, S. H., Park, J. C., Park, J. Y. & Kim, Y-H., 2016 Aug 1, In : Microelectronics Reliability. 63, p. 194-200 7 p.

Research output: Contribution to journalArticle

resistors
Resistors
shock
chips
Intermetallics
3 Citations (Scopus)
solders
Surface chemistry
Soldering alloys
wetting
Intermetallics
3 Citations (Scopus)

Effects of bath composition on the adhesion characteristics of electroless Cu layers on epoxy-based polymer substrates

Seong, H., Kim, S. C., Choi, D. J., Lee, J. Y., Ko, Y. J., Yoon, S. B., Seo, M. L. & Kim, Y-H., 2016 Jan 1, In : Journal of the Electrochemical Society. 163, 6, p. D250-D255

Research output: Contribution to journalArticle

Electrolytes
Polymers
Adhesion
Electroless plating
Substrates
5 Citations (Scopus)

Improvement of the adhesion between polyaniline and commercial carbon paper by acid treatment and its application in supercapacitor electrodes

Choi, D. J., Boscá, A., Pedrós, J., Martínez, J., Barranco, V., Rojo, J. M., Yoo, J. J., Kim, Y. H. & Calle, F., 2016 Feb 12, In : Composite Interfaces. 23, 2, p. 133-143 11 p.

Research output: Contribution to journalArticle

Carboxylation
Electrolytic capacitors
Capacitors
Carbon
Adhesion
4 Citations (Scopus)

Low temperature chip on film bonding technology for 20 µm pitch applications

Kim, S. C. & Kim, Y-H., 2016 Apr 1, In : Journal of Materials Science: Materials in Electronics. 27, 4, p. 3658-3667 10 p.

Research output: Contribution to journalArticle

chips
adhesives
Adhesives
Contact resistance
contact resistance
2 Citations (Scopus)

The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding

Kim, S. C., Lee, J. Y., Park, J. Y., Lee, T. Y. & Kim, Y-H., 2016 Jul 1, In : Journal of Materials Science: Materials in Electronics. 27, 7, p. 6646-6655 10 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
adhesives
wetting
Wetting
2015
5 Citations (Scopus)

Current-assisted direct Cu/Cu joining

Shin, C., Ma, S. W., Lee, J. H., Kim, K. B., Suh, M., Kim, N. & Kim, Y-H., 2015 Jan 1, In : Scripta Materialia. 104, p. 21-24 4 p.

Research output: Contribution to journalArticle

Joining
Joule heating
Electromigration
electromigration
Contact resistance
6 Citations (Scopus)

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive

Harr, K. M., Kim, S. C., Kim, Y. M. & Kim, Y-H., 2015 Jan 1, In : Microelectronics Reliability. 55, 8, p. 1241-1247 7 p., 11539.

Research output: Contribution to journalArticle

adhesives
Adhesives
chips
Contact resistance
contact resistance
9 Citations (Scopus)

Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer

Park, J. Y., Kim, Y. M. & Kim, Y-H., 2015 Aug 23, In : Journal of Materials Science: Materials in Electronics. 26, 8, p. 5852-5862 11 p.

Research output: Contribution to journalArticle

solders
Soldering alloys
wetting
Wetting
Aging of materials
5 Citations (Scopus)

Mechanical and electrical stability of PEDOT:PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditions

Abdur, R., Lee, Y. K., Jeong, K., Nam, H. S., Kim, Y. H., Kim, J. & Lee, J., 2015 Jul 13, In : Organic Electronics. 26, p. 8-14 7 p.

Research output: Contribution to journalArticle

Electric field effects
Plastic films
Semiconducting organic compounds
Mechanical stability
Bending tests
5 Citations (Scopus)

The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devices

Choi, D. J., Kim, J. K., Seong, H., Jang, M. S. & Kim, Y-H., 2015 Dec 1, In : Organic Electronics. 27, p. 65-71 7 p., 3261.

Research output: Contribution to journalArticle

curing
polyimides
Polyimides
Curing
Polymers
2014
1 Citation (Scopus)

Chip to chip bonding using cu bumps capped with thin Sn layers and the effect of microstructure on the shear strength of joints

Kim, Y. H., Ma, S. W. & Kim, Y-H., 2014 Jan 1, In : Journal of Electronic Materials. 43, 9, p. 3296-3306 11 p.

Research output: Contribution to journalArticle

shear strength
Shear strength
chips
microstructure
Microstructure
5 Citations (Scopus)

Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties

Choi, D. J., Maeng, J. S., Ahn, K. O., Jung, M. J., Song, S. H. & Kim, Y-H., 2014 Sep 19, In : Nanotechnology. 25, 37, 375604.

Research output: Contribution to journalArticle

Polyimides
Powders
Nanocomposites
Optical properties
Nanoparticles
7 Citations (Scopus)

Synthesis of dual nanoparticles embedded in polyimide and their optical properties

Maeng, J. S., Choi, D. J., Ahn, K. O. & Kim, Y-H., 2014 Jan 1, In : Electronic Materials Letters. 10, 6, p. 1019-1025 7 p.

Research output: Contribution to journalArticle

Polyimides
Optical properties
Nanoparticles
Salts
Metals
2013
10 Citations (Scopus)

Adhesion study between electroless seed layers and build-up dielectric film substrates

Sun, J. Y., Hong, D. H., Ahn, K. O., Park, S. H., Park, J. Y. & Kim, Y-H., 2013 Apr 2, In : Journal of the Electrochemical Society. 160, 3

Research output: Contribution to journalArticle

Dielectric films
Seed
Adhesion
Substrates
Bond strength (materials)
1 Citation (Scopus)

An eco-friendly Cu-Zn wetting layer for highly reliable solder joints

Kim, Y. M., Kim, S. C. & Kim, Y-H., 2013 Sep 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 755-760 6 p. 6575657

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Wetting
Cyanides
Thermal cycling
Electroplating
1 Citation (Scopus)

Development of highly reliable flip-chip bonding technology using non-conductive adhesives (NCAs) for 20 μm pitch application

Kim, S. C., Hong, M. H., Lee, J. H. & Kim, Y-H., 2013 Sep 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 785-789 5 p. 6575662. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesives
Electronics packaging
Thermal cycling
Contact resistance
Thermal expansion
4 Citations (Scopus)

Effect of permanganate treatment on through mold vias for an embedded wafer level package

Park, S. H., Park, J. Y. & Kim, Y-H., 2013 Jul 1, In : Electronic Materials Letters. 9, 4, p. 459-462 4 p.

Research output: Contribution to journalArticle

Metallizing
Molding
Fillers
Epoxy Resins
Sheet molding compounds
3 Citations (Scopus)

Electrical characteristics of resistive switching memory with metal oxide nanoparticles on a graphene layer

Lee, D. U., Kim, D., Kim, E. K., Cho, W. J., Kim, Y-H. & Im, H., 2013 Sep 30, In : Thin Solid Films. 543, p. 106-109 4 p.

Research output: Contribution to journalArticle

Graphite
Oxides
Graphene
metal oxides
graphene
16 Citations (Scopus)

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x = 0-35 wt%) or Cu-xZn-yNi (x = 20 and 25 wt%, y = 15 and 10 wt%) substrates

Kim, Y. M., Kim, T. J., Choi, M. Y. & Kim, Y-H., 2013 Jan 1, In : Journal of Alloys and Compounds. 575, p. 350-358 9 p.

Research output: Contribution to journalArticle

Surface chemistry
Soldering alloys
Intermetallics
Substrates
Soldering
46 Citations (Scopus)

Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)

Kim, S. C. & Kim, Y-H., 2013 Jul 20, In : Current Applied Physics. 13, 4 SUPPL.2

Research output: Contribution to journalArticle

Conductive films
adhesives
Adhesives
chips
soldering
3 Citations (Scopus)

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering

Lee, J. H., Ma, S. W., Kim, Y. M., Lee, J. S., Kim, K. B., Kim, J. M., Oh, J. S., Kim, N. & Kim, Y-H., 2013 Sep 1, In : Journal of Materials Science: Materials in Electronics. 24, 9, p. 3255-3261 7 p.

Research output: Contribution to journalArticle

soldering
Soldering
solders
Surface chemistry
Soldering alloys
20 Citations (Scopus)

The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells

Choi, H., Kim, J., Nahm, C., Kim, C., Nam, S., Kang, J., Lee, B., Hwang, T., Kang, S., Choi, D. J., Kim, Y-H. & Park, B., 2013 Nov 1, In : Nano Energy. 2, 6, p. 1218-1224 7 p.

Research output: Contribution to journalArticle

Electrolytes
Semiconductor quantum dots
Solar cells
Coatings
Electrodes
14 Citations (Scopus)

Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders

Lee, J. H., Kim, Y. M., Hwang, J. H. & Kim, Y-H., 2013 Aug 5, In : Journal of Alloys and Compounds. 567, p. 10-14 5 p.

Research output: Contribution to journalArticle

Soldering alloys
Wetting
Fluxes
Water
Soldering
2012

Development of low temperature Chip-on-Flex (COF) bonding process of 100°C

Kim, S. C. & Kim, Y-H., 2012 Dec 1, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507904. (14th International Conference on Electronic Materials and Packaging, EMAP 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Contact resistance
Temperature
Compaction
Conductive films
Domes
24 Citations (Scopus)
shear strength
Palladium
solders
Surface chemistry
Nickel
3 Citations (Scopus)

Effect of plasma etching on photoluminescence of SnO x/Sn nanoparticles deposited on DOPC lipid membrane

An, H. H., Lee, S. J., Baek, S. H., Han, W. B., Kim, Y. H., Yoon, C. S. & Suh, S. H., 2012 Feb 15, In : Journal of Colloid and Interface Science. 368, 1, p. 257-262 6 p.

Research output: Contribution to journalArticle

Plasma etching
Membrane Lipids
Photoluminescence
Nanoparticles
Phospholipids
1 Citation (Scopus)

Fabrication of copper nanoparticles in a thick polyimide film cured by rapid thermal annealing

Choi, M. Y., Choi, D. J., Ahn, K. O., Ro, I., Kim, Y-H. & Suh, S. H., 2012 Jul 6, In : Journal of Nanoscience and Nanotechnology. 12, 4, p. 3637-3640 4 p.

Research output: Contribution to journalArticle

Nanoparticles
Copper
Hot Temperature
Atmosphere
Fourier Transform Infrared Spectroscopy
13 Citations (Scopus)

Facile synthesis of porous-carbon/LiFePO 4 nanocomposites

Wi, S., Nam, S., Oh, Y., Kim, J., Choi, H., Hong, S., Byun, S., Kang, S., Choi, D. J., Ahn, K. O., Kim, Y-H. & Park, B., 2012 Dec 1, In : Journal of Nanoparticle Research. 14, 12, 1327.

Research output: Contribution to journalArticle

Nanocomposites
nanocomposites
Carbon
Synthesis
Electrochemical properties
4 Citations (Scopus)

Formation of Ag nanostrings induced by lyotropic liquid-crystalline phospholipid multilayer

Kim, S. J., An, H. H., Lee, S. J., Lee, J. H., Kim, Y-H., Yoon, C. S. & Suh, S. H., 2012 Jan 10, In : Langmuir. 28, 1, p. 259-263 5 p.

Research output: Contribution to journalArticle

Phospholipids
Multilayers
Nanoparticles
Crystalline materials
nanoparticles
2 Citations (Scopus)

Interface analysis of embedded chip resistor device package and its effect on drop shock reliability

Park, S. H., Kim, S. K. & Kim, Y. H., 2012 Jul 6, In : Journal of Nanoscience and Nanotechnology. 12, 4, p. 3186-3190 5 p.

Research output: Contribution to journalArticle

Tin
Shock
Equipment and Supplies
Copper
Polychlorinated Biphenyls
2 Citations (Scopus)

Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates

Hwang, J. H., Kim, Y. M., Kim, T. J., Kim, Y-H. & Lee, W. J., 2012 Dec 1, ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. p. 426-429 4 p. 6474650

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Intermetallics
Aging of materials
Substrates
Thermal aging
5 Citations (Scopus)

Resistive switching effect for ZnO hybrid memory with metal-oxide nanocrystals

Lee, D. U., Kim, E. K., Cho, W. J., Kim, Y-H. & Im, H., 2012 Oct 30, In : Thin Solid Films. 521, p. 98-101 4 p.

Research output: Contribution to journalArticle

Nanocrystals
Oxides
metal oxides
nanocrystals
Metals
3 Citations (Scopus)

Resistive-switching memory effect of hybrid structures with polyimide and SnO 2 nanocrystals

Lee, D. U., Kim, S. P., Kim, E. K., Cho, W. J., Kim, Y-H. & Im, H., 2012 Jul 1, In : Journal of nanoscience and nanotechnology. 12, 7, p. 5449-5452 4 p.

Research output: Contribution to journalArticle

Nanoparticles
Aluminum Oxide
Electrodes
Oxygen
Equipment and Supplies
Nanotechnology
nanotechnology
electronics