• 2002 Citations
  • 21 h-Index
1987 …2020

Research output per year

If you made any changes in Pure these will be visible here soon.

Fingerprint Dive into the research topics where Young-Ho Kim is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output

  • 1 Scopus citations

    Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints

    Park, J. Y., Lee, T., Seo, W., Yoo, S. & Kim, Y-H., 2019 Jan 1, In : Journal of Materials Science: Materials in Electronics.

    Research output: Contribution to journalArticle

  • 1 Scopus citations

    Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding

    Park, J. Y., Lee, J. Y., Park, H. P., Kim, S. C., Lee, T. Y., Yoo, S. & Kim, Y-H., 2019 Aug 15, In : Microelectronic Engineering. 216, 110973.

    Research output: Contribution to journalArticle

  • 1 Scopus citations

    Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

    Park, H. P., Seo, G., Kim, S., Ahn, K. O. & Kim, Y. H., 2019 Jun 15, In : Journal of Materials Science: Materials in Electronics. 30, 11, p. 10550-10559 10 p.

    Research output: Contribution to journalArticle

  • 1 Scopus citations