• 1866 Citations
  • 21 h-Index
1987 …2019
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Fingerprint Dive into the research topics where Young-Ho Kim is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

polyimides Physics & Astronomy
Polyimides Engineering & Materials Science
Soldering alloys Engineering & Materials Science
Intermetallics Engineering & Materials Science
Nanoparticles Engineering & Materials Science
solders Physics & Astronomy
Contact resistance Engineering & Materials Science
nanoparticles Physics & Astronomy

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Research Output 1987 2019

Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints

Park, J. Y., Lee, T., Seo, W., Yoo, S. & Kim, Y-H., 2019 Jan 1, In : Journal of Materials Science: Materials in Electronics.

Research output: Contribution to journalArticleResearchpeer-review

Electromigration
electromigration
solders
Soldering alloys
Intermetallics

Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding

Park, J. Y., Lee, J. Y., Park, H. P., Kim, S. C., Lee, T. Y., Yoo, S. & Kim, Y-H., 2019 Aug 15, In : Microelectronic Engineering. 216, 110973.

Research output: Contribution to journalArticleResearchpeer-review

adhesives
Adhesives
Temperature
Acoustic impedance
electrical resistance

Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

Park, H. P., Seo, G., Kim, S., Ahn, K. O. & Kim, Y-H., 2019 Jun 15, In : Journal of Materials Science: Materials in Electronics. 30, 11, p. 10550-10559 10 p.

Research output: Contribution to journalArticleResearchpeer-review

shear strength
solders
fans
Shear strength
Soldering alloys
1 Citation (Scopus)

A peel adhesion study of electroless Cu layers on polymer substrates

Kim, S. C., Seong, H., Ahn, K. O., Choi, D. J., Lee, J. Y., Ko, Y. J., Yoon, S. B., Seo, M. L. & Kim, Y-H., 2018 Jan 2, In : Journal of Adhesion. 94, 1, p. 1-14 14 p.

Research output: Contribution to journalArticleResearchpeer-review

Polymers
adhesion
Adhesion
polymers
Substrates

Controlling die warpage by applying under bump metallurgy for fan-out package process applications

Park, H. P., Kim, Y-H., Jang, Y. M. & Choa, S. H., 2018 Aug 7, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1912-1919 8 p. 8429799. (Proceedings - Electronic Components and Technology Conference; vol. 2018-May).

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Metallurgy
Fans
Polyimides
Soldering alloys
Copper