• Source: Scopus
  • Calculated based on no. of publications stored in Pure and citations from Scopus
20012020

Research activity per year

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Network

Byonghyo Shim

  • Korea University
  • School of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Seoul National University
  • Inst. of New Media and Commun.
  • Coordinated Science Laboratory
  • EECS Dept.
  • School of Information and Communication
  • School of Electrical and Computer Engineering
  • School of Electrical Engineering and INMC
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • School of Information and Communication

External person

Andrew C. Singer

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Coordinated Science Lab.
  • Department of Electrical and Computer Engineering

External person

Jaekyum Kim

  • Department of Electrical Engineering
  • Hanyang University
  • Engineering Center
  • Div. of Electrical and Biomedical Engineering

External person

James C. Preisig

  • Department of Applied Ocean Physics and Engineering
  • Woods Hole Oceanographic Institution

External person

Nam Ik Cho

  • School of Electrical Engineering and Computer Sciences
  • Seoul National University
  • School of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Sch. of Elec. Eng./Computer Science
  • Sch. of Elec./Computer Engineering
  • School of Electrical Engineering
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science

External person

Jinhyeok Yoo

  • Engineering Center
  • Hanyang University
  • Department of Electrical Engineering
  • Seoul National University

External person

Sun Hong Lim

  • Hanyang University
  • Department of Electrical Engineering

External person

Kyeongyeon Kim

  • Coordinated Science Lab.
  • University of Illinois at Urbana-Champaign
  • Samsung Advanced Institute of Technology
  • Samsung
  • Department of Electrical and Computer Engineering

External person

Thomas J. Riedl

  • Coordinated Science Lab.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Behrouz Farhang-Boroujeny

  • Department of Electrical and Computer Engineering
  • University of Utah

External person

Hong Wan

  • Department of Electrical and Computer Engineering
  • University of Utah

External person

Sunho Park

  • School of Information and Communication
  • Department of Electrical and Computer Engineering
  • Korea University
  • Seoul National University
  • Inst. of New Media and Commun.
  • School of Electrical Engineering and INMC

External person

Rong Rong Chen

  • Department of Electrical and Computer Engineering
  • University of Utah

External person

Byeoungdo Kim

  • Department of Electrical Engineering
  • Hanyang University
  • Div. of Electrical and Biomedical Engineering

External person

Junho Koh

  • Department of Electrical Engineering
  • Hanyang University

External person

Yecheol Kim

  • Hanyang University

External person

Insung Kang

  • Qualcomm Incorporated

External person

Ji Yun Seol

  • Samsung
  • Cornrnunications Research Team

External person

Dongsuk Kum

  • Korea Advanced Institute of Science and Technology

External person

Seok Ho Chang

  • Department of Computer Science and Engineering
  • Dankook University
  • CSE Dept.

External person

Jisu Bae

  • Engineering Center
  • Hanyang University

External person

Chang Mook Kang

  • Department of Electrical Engineering
  • Hanyang University
  • Korean Agency for Defense Development
  • Department of Electronic Engineering
  • MANDO Corporation
  • Global R and D Center
  • Incheon National University
  • Mando Corporation

External person

Seungnyun Kim

  • Department of Electrical and Computer Engineering
  • Seoul National University

External person

Sunghyun Choi

  • Seoul National University

External person

Ik Joon Chang

  • School of Electronics and Information
  • Kyung Hee University
  • Seoul National University

External person

Jaehyung Choi

  • Phantom AI, Inc.
  • Phantom AI

External person

Jihwan P. Choi

  • ICE Dept.
  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Information Communication Engineering

External person

Chang Hyun Kim

  • Samsung
  • Research Institute of Industrial Science
  • Hanyang University
  • Department of Civil Engineering
  • Semiconductor R and D Center
  • Photomask Team
  • Memory R and D Center
  • Department of Electrical Engineering
  • Korea Marine Equipment Research Institute
  • Noksan National Industrial Complex
  • Vision College of Jeonju
  • Department of Electricity
  • Artificial Intelligent and Mechatronics Research Center
  • Korea Electronics Technology Institute
  • Korea Marine Equipment Research Institute

External person

Erica L. Daly

  • Coordinated Science Lab.
  • University of Illinois at Urbana-Champaign

External person

Suhanya Jayaprakasam

  • Department of Electronic Engineering
  • Hanyang University
  • Department of Electronics and Computer Engineering

External person

Jun Hui Won

  • Department of Electrical Engineering
  • Hanyang University

External person

Hyunmin Chae

  • Department of Electrical Engineering
  • Hanyang University

External person

Hyoungju Ji

  • Seoul National University
  • Department of Electrical and Computer Engineering

External person

Jong Suk Lim

  • Department of Electrical Engineering
  • Hanyang University

External person

Tae Hyun Kim

  • Soundlly, Inc.

External person

Byungju Lee

  • Korea University

External person

Junghwan Lee

  • Department of Electrical Engineering
  • Hanyang University
  • Div. of Electrical and Biomedical Engineering

External person

Jungwoo Lee

  • Department of Chemistry
  • LG Corporation
  • Hanyang University
  • Department of Electrical and Computer Engineering
  • Seoul National University
  • Laboratory of Molecular Biochemistry

External person

Seung Taek Oh

  • Hanyang University
  • Department of Electrical Engineering

External person

Furui Bai

  • Pensees Singapore Institute

External person

Meesue Shin

  • CSE Dept.
  • Dankook University

External person

Zhikang Wang

  • Pensees Singapore Institute

External person

Aijin Li

  • Xidian University

External person

Meixia Jia

  • Xidian University

External person

Lars Sommer

  • Fraunhofer Institute of Optronics, System Technologies and Image Exploitation

External person

Soonwon Ka

  • Soundlly, Inc.

External person

Wei Dai

  • Snowcloud.ai

External person

Seung Hi Lee

  • Samsung Advanced Institute of Technology
  • Div. of Electrical and Biomedical Engineering
  • Hanyang University
  • Storage Laboratory
  • Department of Electrical Engineering
  • Department of Electronic Engineering
  • Departments of Electric Engineering
  • Department of Electronics and Computer Engineering
  • Electro-Mechanics Lab.
  • Div. of Elec. and Comp. Engineering
  • Nano Systems Laboratory
  • IEEE
  • Storage Lab.
  • SATT
  • Department of Electrical Engineering
  • Nano Systems Laboratory
  • Intelligent System Research Center
  • Sungkyunkwan University
  • Div. of Electrical and Biomedical Engineering
  • Hanyang Univerity
  • Samsung
  • Department of Electrical Engineering
  • Hongik University

External person

Huchuan Lu

  • Dalian University of Technology

External person

Donghyeon Cho

  • SK Corporation

External person

Minh Son Le

  • Seoul National University

External person

Xin Chen

  • Dalian University of Technology

External person

Youngseok Kim

  • Hanyang University
  • IBM Research
  • Korea Advanced Institute of Science and Technology

External person

Jingjing Xu

  • Nanjing University of Posts and Telecommunications

External person

Jingkai Zhou

  • South China University of Technology

External person

Longyin Wen

  • JD Finance America Corporation
  • JD Digits
  • Mountain View

External person

Xuankun Chen

  • Sun Yat-Sen University

External person

Sai Saketh Chennamsetty

  • Siemens Technology and Services Private Limited

External person

Arne Schumann

  • Fraunhofer Institute of Optronics, System Technologies and Image Exploitation

External person

Jill K. Nelson

  • George Mason University

External person

Xin Zhang

  • Chinese Academy of Sciences
  • Ocean University of China

External person

Zexin Wang

  • Xidian University

External person

Sang Yoon Park

  • Department of Electronic Engineering
  • Myongji University
  • Sch. of Elec. Eng./Computer Science
  • Seoul National University

External person

Yanchao Li

  • Pensees Singapore Institute

External person

Jisong Kim

  • Hanyang University

External person

Andrew Bean

  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Kyungtae Kim

  • Beckman Institute
  • University of Illinois at Urbana-Champaign

External person

Jane Shen

  • Pensees Singapore Institute

External person

Xiaorui Wang

  • Ocean University of China

External person

Lianghua Huang

  • Chinese Academy of Sciences

External person

Chunlei Huo

  • Chinese Academy of Sciences

External person

Keyang Wang

  • Chongqing University

External person

Hongliang Li

  • University of Electronic Science and Technology of China

External person

Woong Jo

  • Department of Electrical Engineering
  • Hanyang University

External person

Junhao Hu

  • ShanghaiTech University

External person

Da Yu

  • Harbin Institute of Technology

External person

Weida Qin

  • South China University of Technology

External person

Kaiqi Huang

  • Chinese Academy of Sciences

External person

Aashish Kumar

  • Harman-Samsung

External person

Jaeseok Lee

  • Department of Information and Communication Engineering
  • Daegu Gyeongbuk Institute of Science and Technology

External person

Ziming Liu

  • Beijing Institute of Technology

External person

Qishang Cheng

  • University of Electronic Science and Technology of China

External person

Youngbae Hwang

  • Multimedia IP Research Center
  • Korea Electronics Technology Institute

External person

Haibin Ling

  • Stony Brook University

External person

Jiayu Zheng

  • Tianjin University

External person

Di Li

  • Xidian University

External person

Haitao Xiong

  • South China University of Technology

External person

Hyun Kim

  • Seoul National University

External person

Byungju Lee

  • Korea University
  • School of Electrical and Computer Engineering
  • Seoul National University
  • Department of Materials Science and Engineering

External person

Robert J. Drost

  • Coordinated Science Lab.
  • University of Illinois at Urbana-Champaign

External person

Seung Hyun Kong

  • Korea Advanced Institute of Science and Technology

External person

Zichen Song

  • University of Electronic Science and Technology of China

External person

Pengyi Zhang

  • Beijing Institute of Technology

External person

Byeongdo Kim

  • Department of Electrical Engineering
  • Hanyang University

External person

Xindi Zhang

  • Queen Mary University of London

External person

Su Cheol Shin

  • Department of Electrical Engineering
  • Hanyang University

External person

Seong Hyeon Park

  • Department of Electrical Engineering
  • Hanyang University

External person

George Jose

  • Harman-Samsung

External person

Tuo Feng

  • Xidian University

External person

Junyi Zhang

  • Sun Yat-Sen University

External person

Xinyu Zhang

  • Dalian University of Technology

External person

Changrui Chen

  • Ocean University of China

External person

Tae Hoon Kim

  • Department of Electrical Engineering
  • Hanyang University

External person

Hailin Shi

  • JD AI Research

External person

Sang Hyun Lee

  • Seoul National University

External person

Xiao Bian

  • General Electric

External person

Dong In Kim

  • School of Information and Communication Engineering
  • Sungkyunkwan University

External person

Seung Heon Lee

  • Hanyang University

External person

Xudong Wei

  • Xi'an Jiaotong University

External person

Chunhong Pan

  • Chinese Academy of Sciences

External person

Kyusic Kang

  • Department of Electronics and Computer Engineering
  • Hanyang University

External person

Qiang Chen

  • Chinese Academy of Sciences

External person

Yifu Chen

  • Harbin Institute of Technology

External person

Shuhao Chen

  • Dalian University of Technology

External person

Duy Thanh Nguyen

  • Seoul National University

External person

Xin Sun

  • Ocean University of China

External person

Jonas Meier

  • Fraunhofer Institute of Optronics, System Technologies and Image Exploitation

External person

Yacong Ding

  • University of California at San Diego
  • Department of Electrical and Computer Engineering
  • University of California at San Diego

External person

Xuzhang Zhang

  • Huazhong University of Science and Technology

External person

Chang Liu

  • Dalian University of Technology

External person

Seung Joo Kim

  • Koera Testing Certification Gunpo

External person

Varghese Alex Kollerathu

  • Siemens Technology and Services Private Limited

External person

Shuo Wei

  • Ocean University of China

External person

Dongyu Zhang

  • Sun Yat-Sen University

External person

Yisheng Lv

  • Chinese Academy of Sciences

External person

Ali Irtaza Sayed

  • Department of Electrical Engineering
  • Hanyang University

External person

Yu Zhu

  • Chinese Academy of Sciences

External person

Hyun Jong Eom

  • Hanyang University

External person

Scokhyeon Bang

  • Hanyang University

External person

Yue Zhang

  • JD Digits

External person

Pengfei Zhu

  • Tianjin University

External person

Weiyang Wang

  • Snowcloud.ai

External person

Jaeyoon Lee

  • Department of Electronics and Computer Engineering
  • Hanyang University
  • SMEs Cooperation Team
  • Electronics and Telecommunications Research Institute
  • Department of Electronic Engineering
  • Department of Electronics and Communications Engineering
  • Department of Electronic and Communications Engineering
  • Department of Electronics and Communications Engineering

External person

Boyeal Kim

  • Seoul National University

External person

Hyewon Lee

  • Soundlly, Inc.
  • Seoul National University

External person

Dong Wang

  • Dalian University of Technology

External person

Jae Yeol Ha

  • Soundlly, Inc.

External person

Qiong Liu

  • South China University of Technology

External person

Jaekyum Kim

  • Hanyang University

External person

Dening Zeng

  • Xidian University

External person

Hai L. Vu

  • Monash University

External person

Sungil Kang

  • SK Corporation

External person

Syed Ali Irtaza

  • Department of Electrical Engineering
  • Hanyang University

External person

Byeongwon Lee

  • SK Corporation

External person

Xiaoxue Ma

  • Department of Computer Science
  • City University of Hong Kong

External person

Suleyman S. Kozat

  • Koc University

External person

Tao Peng

  • Tianjin University

External person

Guizhong Liu

  • Xi'an Jiaotong University

External person

Guangyu Gao

  • Beijing Institute of Technology

External person

Hee Gul Park

  • Ericsson AB

External person

Hyuk Jae Lee

  • Seoul National University

External person

Rui Zhu

  • JD AI Research

External person

Xiaoyu Chen

  • University of Electronic Science and Technology of China

External person

Lei Jin

  • ShanghaiTech University

External person

Dheeraj Reddy Pailla

  • Siemens Technology and Services Private Limited

External person

Jing Ge

  • Beijing Institute of Technology

External person

Sanmin Kim

  • Korea Advanced Institute of Science and Technology

External person

Brendan Tran Morris

  • University of Nevada Las Vegas

External person

Xinyao Wang

  • JD Digits

External person

Haoran Wang

  • Xidian University

External person

Juan Carlos Cano

  • Polytechnic University of Valencia

External person

Binjie Mao

  • Chinese Academy of Sciences

External person

Ik Cho Nam

  • Coordinated Science Laboratory
  • Seoul National University
  • University of Illinois at Urbana-Champaign

External person

Sungeun Hong

  • SK Corporation

External person

Soohwang Chae

  • Department of Electrical Engineering
  • Hanyang University

External person

Ildoo Kim

  • Kakao Corp

External person

Seung Joo Kim

  • Department of Electrical Engineering
  • Hanyang University
  • Gyeongsang National University
  • Department of Electrical Engineering
  • Department of Materials and Science Engineering
  • Korea University
  • Department of Orthopaedic Surgery
  • Department of Biomedical Engineering
  • Department of Energy Systems Research
  • Ajou University
  • Motor Technology Center Koera Testing
  • Koera Testing Certification Gunpo

External person

Bhaskar Rao

  • University of California at San Diego
  • Department of Electrical and Computer Engineering
  • University of California at San Diego

External person

Chulyoung Kwak

  • Seoul National University

External person

Lucas Steinmann

  • Fraunhofer Institute of Optronics, System Technologies and Image Exploitation

External person

Heqian Qiu

  • University of Electronic Science and Technology of China

External person

Nuo Xu

  • Chinese Academy of Sciences

External person

Junying Huang

  • Sun Yat-Sen University

External person

Seongjin Ahn

  • Department of Electronics and Computer Engineering
  • Hanyang University
  • Department of Electronic Engineering

External person

Yunxin Zhong

  • Beijing Institute of Technology

External person

Xin Zhao

  • Chinese Academy of Sciences

External person

Qingxuan Lv

  • Ocean University of China

External person

Dawei Du

  • SUNY Albany

External person

Dechun Cong

  • Nanjing University of Posts and Telecommunications

External person

Hao Qi

  • Xi'an Jiaotong University

External person

Liefeng Bo

  • JD Digits

External person

Qinghua Hu

  • SUNY Albany

External person

Lei Zhang

  • Chongqing University

External person

Lin Sun

  • Samsung

External person

Dohun Kwon

  • Seoul National University

External person

Junho Lee

  • Departments of Electric Engineering
  • Hanyang University

External person

Jihoon Lee

  • Kakao Corp

External person

Tong Wu

  • Beijing Institute of Technology

External person

Yu Heng Toh

  • Pensees Singapore Institute

External person

Wanqi Li

  • Xi'an Jiaotong University

External person